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OEM integration

 

300mm batch/single OEM handling system

Comet 300mm OEM BHS allows the single or batch wafer transfer of 300mm wafers from one FOUP/FOSB to inspection position and back.
Fully designed for OEM integration the 300mm OEM BSH is dedicated to various inspection and measurement applications, such as:
Defect analysis
Surface analysis
Thickness measurement
Resistivity measurement

Transfer FOUP/FOSB compatible
25 to 25 wafers
Single wafer 300mm

  300MM BATCH/SINGLE OEM HANDLING SYSTEM

Options

Ionization system
Fan filter unit
Bar code gun
Empty/cross/double slot mapping
Performance
Average loading/unloading time < 1mn

Standard features

Fully automated FOUP/FOSB/FFO management
Optimized footprint
1 or 2 load port
Operator touch screen
Easy for integration to any 300mm tool
IR/FR or barcode FOUP ID
Interface RJ45 or RS 232/TCP/IP
OHT/AGV/PGV load port
Tower light

 

Specification

CE certification
SEMI Standard
Class1

Software flexibility

Standard or customizable software
Wafer recoveries
Restart after error
Option multiple
Friendly interface and customizable
Easy integration with other systems by SECII-GEM, ASCII, RS, TCPIP

Facility requirements

Weight: 650 kg
Power: 100-240 VAC, 50-60 hz
Full load consumption: 5 amps
No need for compressed air

 




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