Comet MLT

Product description

The COMET MLT  philosophy about production tube furnace is a complete automation from wafer load to wafer unload in one-button operation.

The COMET MLT is a complete automation with a loader capacity from 6 to 12 cassettes, used to load and  unload 1 to 200 wafers 6″ and 8″ in one-button operation, from cassettes to boat.

Fully automated, connected to the host, the COMET MLT is able to recognize each carrier and boat after unloading the wafers from the furnace. On line scanning of the wafers allows the automation to load and unload dummies wafers and prevent cross slotting.


Product information

Key system features

  • Batch wafer transfer from cassette to boat
  • Loader capacity from 6 to o 12 cassettes
  • Wafer size 6″ or 8″
  • SECS-GEM communication (SECS I or HSMS)
  • Customized according customer cassettes/ boats and wafers
  • Optimized footprint
  • Easy for integration to any 150 or 200mm tool
  • Fast, clean, reliable and accurate

Standard features

  • Peek material for pushers, retainers and boat adaptors
  • IR heat sensor
  • Operator touch screen
  • Interface Ethernet (TCP/IP – RJ45) and RS 232 (DB9)
  • Double cassette/boat sensors
  • Carrier correctly positioned (mechanical)
  • Wafer presence detection into cassette/boat
  • Current limit on all motors
  • Power “off” security
  • Open frame, designed for a vertical laminar flow
  • Automatic home position
  • Historical data recorded (error messages data time)
  • Clean room color paper documentation

Software flexibility

  • Standard or customizable software
  • Restart after error
  • Option multiple
  • Friendly interface and customizable
  • Easy integration with other systems by SECII-GEM, ASCII, RS, TCPIP


  • CE certification
  • SEMI Standard
  • Class 1


  • Average loading/unloading time: < 4mn for 150 wafers
  • MTBF:> 3000 hrs
  • MTBA: 750 hrs
  • MTTR: < 1 hr
  • Breakage rate: 1 for 5.104

Facilities and Requirements

  • Weight: 150 kg
  • Power: 100-240 VAC 75 watts
  • Frequency: 50-60 Hz
  • Full Load Amps: 1.2-0.6 A
  • No need for compressed air


  • SECS/GEM : Machine includes SECS/GEM communication:  RS232 – E4 SECS I and Ethernet – E37 HSMS-SS (TCP/IP)
  • ESD: Electrostatic dissipation of the wafers thanks to ESD material of the parts touching wafers (combs)
  • Flat /Notch aligner: Integrated Flat or Notch aligner system.