HBT Stand Alone


Product description

 

The HBT Stand Alone systems are Horizontal Batch Transfer machine allowing transfer in batches, batch splitting and merging.

These equipments are mainly required when the vertical batch transfer is unsafe, because of two main reason:

⇒ Significant warping of the wafers, with high risk of wafer breakage on batch splitting and merging transfer;

⇒ Cassette with insufisant or absent narrow bottom slot, when the position of the wafers in the slots does not allow them to be picked up correctly.
The HBT Stand Alone systems are the best solutions to transfer safely your wafer batches, even with warped wafers or special cassettes.

To transfer wafer batch, the machine is equipped with a gripper of 13 postions, with 2 edge contact ceramic finger for each position that ensure an accurate and safe handling of wafers.

Transfer available:

  • 13 to 13
  • 25 to 25
  • 13+12 to 25,  and reverse
  • 13 to 25 ODD,  and reverse
  • 13 to 25 EVEN,  and reverse

 

Thanks to cassette kinds detection system and wafer mapping system, the user only have to drop his cassette to the load ports according his transfer need, select the thickness of the wafer to transfer and launch the mapping. Once the mapping done, the machine will only propose to the user the possible transfer to perform via the interface. The User only have to click on the interface to launch the requested transfer.

Moreover,  the HBT 3LP systems can be used on local mode or on remote mode thanks to SECS-GEM communication to the fab host (E30), and meet the requirements to be loaded/unloaded  by AVG/RVG, providing a E84 connection for each load ports to install PIO. (optional)


Product information

Key system features

  • Horizontal Batch Transfer system
  • 2, 3 or 4 Load Ports
  • Batch copying, merging or splitting
  • Wafer edge contact gripper
  • Wafer size: 150mm OR 200mm
  • Wafer bow: ± 0.5 mm
  • Customized according customer cassettes and wafers

Standard features

  • Gripper: 13 positions with 2 edge contact ceramic finger for each position
  • 12” color LCD Touchscreen + Keyboard
  • Automatic mapping system with cross slot/ double slots detection
  • Wafer detection in cassette
  • Current limiters on all motors
  • Error message and cycles recorded
  • Tower light
  • Clean Room and PDF documentation

Specifications

  • CE certification
  • SEMI Standard
  • Class 1

Options

  • Fan filter unit
  • Carrier TAG reader (RFID or Barcode)
  • Ionization system
  • E84 connection (PIO)
  • SECS/GEM E30 Host connection [HSMS]

Interface

  • Friendly and intuitive interface
  • Standard or customizable software
  • Wafer recorveries
  • Restart after error
  • Easy integration with other systems by SECII-GEM, ASCII, RS, TCPIP

Facilities and Requirements

  • Power: 207 Vac to 264Vac
  • Frequency: 47Hz to 63Hz
  • Full Load Amps: 2.5 A